TSMC today said it will expand its investment in advanced semiconductor manufacturing in the U.S. by an additional $100 billion. Building on the company’s ongoing $65 billion investment in its advanced chip fabs in Phoenix, TSMC’s total investment in the U.S. is expected to reach $165 billion.
‘Plug, Baby, Plug’: France to Use Nuclear Power to Expand AI Computing Capacity
February 11, 2025 by
A country with deep nuclear power resources, France plans to dedicate a gigawatt of it (the power generated by 294 utility-scale wind turbines) for an artificial intelligence computing project that rivals the Stargate project announced last month ….
HPC News Bytes 20250210: Big AI CAPEX Binge, More Data Center SMRs, Euro-Origin Quantum, Softbank Eyes Ampere
February 10, 2025 by
Good post-Super Bowl morning to you! The past week was somewhat calm relative to the riotous preceding period in the world of HPC-AI, but still, important developments emerged. Here’s a fast (5:52) overview ….
Vanguards of HPC-AI: Oak Ridge Lab’s Verónica G. Melesse Vergara — Unleashing ‘Breakthrough Science’
February 5, 2025 by
“One of the most fun aspects of HPC engineering is that you get to solve a broad range of problems getting an application to run well and run at scale – sometimes to even run at all. There is always something new to learn and the feeling of finding a solution ….”
HPC News Bytes 20250203: DeepSeek Lessons, Intel Reroutes GPU Roadmap, LANL and OpenAI for National Security, Nuclear Reactors for Google Data Centers
February 3, 2025 by
The HPC-AI world was upended last week by DeepSeek AI benchmark numbers, as the dust settles we offer commentary on what it may, at this stage, mean: Five lessons from DeepSeek, Intel GPU rack scale architecture ….
Vanguards of HPC-AI: ORNL’s Dr. Feiyi Wang – Unlocking HPC-AI Breakthroughs that Neither Could Do Alone
January 23, 2025 by
“The potential of combining HPC and AI to push scientific boundaries drives me to explore new ways of leveraging these technologies together to unlock breakthroughs that neither could achieve alone. It is no exaggeration to say that the fusion of HPC and AI fuels my career path, allowing me to work at the forefront of scientific innovation.”
HPC News Bytes 20250106: ‘Beyond’ EUV Lithography, China Chip Sanction Workaround, Microsoft’s $80B AI Build-Out, TSMC 2nm in 2025
January 6, 2025 by
Here’s a rapid (5:54) rundown of recent news from the HPC-AI sector, including: DOE and LLNL lead effort to go ‘beyond’ EUV lithography, report: ByteDance pursues chip trade sanction workaround, Microsoft’s $80B AI ….
LLNL to Lead Research on Advancing Extreme Ultraviolet Lithography
January 3, 2025 by
EUV, extreme ultraviolet lithography, is nearly completely associated with the Dutch company ASML, the only maker of EUV machines that are used by TSMC, Intel and other chip manufacturers of advanced HPC-AI chips. Now Lawerence Livermore National Laboratory has ….
HPC News Bytes: The Next New Big Thing in AI?, UALink and Optical I/O, Arm vs. Qualcomm
December 23, 2024 by
A happy holiday season to you! As we enter Christmas week, here’s a quick (6:14) run-through of recent news from the world of HPC-AI, including: long thinking AI – the next new big thing?, UALink and optical I/O – a possible next new big thing in interconnects, Arm vs. Qualcomm ….
Lambda Launches Inference API
December 13, 2024 by
Dec. 13, 2024 — AI company Lambda today announced its Inference API, which the company said enables access to LLMs through a serverless AI for “a fraction of a cent.” The company said Lambda Inference API offers low-cost, scalable AI inference with such models as Meta’s recently released Llama 3.3 70B Instruct (FP8) at $0.20 […]
