Here’s a rapid (5:54) rundown of recent news from the HPC-AI sector, including: DOE and LLNL lead effort to go ‘beyond’ EUV lithography, report: ByteDance pursues chip trade sanction workaround, Microsoft’s $80B AI ....

The post HPC News Bytes 20250106: ‘Beyond’ EUV Lithography, China Chip Sanction Workaround, Microsoft’s $80B AI Build-Out, TSMC 2nm in 2025 appeared first on High-Performance Computing News Analysis | insideHPC.

As machine learning techniques become increasingly used in the sciences, a team of researchers in Lawrence Livermore National Laboratory’s Computing and Physical and Life Sciences directorates are trying to provide a reasonable starting place for scientists who want to apply machine learning but lack a strong ML background. The goal is to help users understand […]

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