A happy mid-winter day to you! The HPC-AI world produced its usual extraordinary onslaught of news this past week, here’s ...

The post HPC News Bytes 20250217: Arm Selling Its Own Chips to Meta?, Big xAI, Big Power, Big… Pollution?, TSMC in Intel Fab Takeover?, Europe’s Big AI Investment, Exascale in Industry appeared first on High-Performance Computing News Analysis | insideHPC.

.... the news from Rick Cassidy, president of TSMC in the U.S., reported by Bloomberg, that the company’s Pheonix fab delivered 4 percent better yield on advanced chips than fab sites in Taiwan is impressive. In chip industry parlance, yield ....

The post TSMC in Arizona Announces Higher Yields than Fabs in Taiwan appeared first on High-Performance Computing News Analysis | insideHPC.

TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – TAMC and Amkor Technology announced today a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract with Amkor’s outsourced semiconductor assembly and test (OSAT) services, in their planned facility in Peoria, Arizona. TSMC will leverage […]

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A good July morning to you! It was a short Fourth of July holiday week in the (U.S.) world of HPC-AI, here’s a rapid (6:04) run-down of news highlights: China’s SMIC wafer yields for Huawei AI chip yield to sanctions, Goldman joins generative AI ROI doubters, startup takes on Nvidia with special-purpose chip

The post HPC News Bytes 20240708: Low Yield Huawei AI Chip, AI ROI Questions, ASIC AI Chip appeared first on High-Performance Computing News Analysis | insideHPC.

A good April morning to you! Chips dominate the HPC-AI news landscape, which has become something of an industry commonplace of late, including: TSMC’s Arizona fab on schedule, the Dutch government makes a pitch to ASML, Intel foundry business's losses, TSMC expands CoWoS capacity, SK hynix to investing in Indiana and Purdue, Quantinuum and Microsoft report 14,000 error-free instances

The post HPC News Bytes 20240408: Chips Ahoy! …and Quantum Error Rate Progress appeared first on High-Performance Computing News Analysis | insideHPC.

A news report from a Chinese news outlet states that chip producer Taiwan Semiconductor Manufacturing Company (TSMC) may have overcome earlier problems at its Arizona advanced-chip fabs....

The post Reports: TSMC Advanced Chip Fab Back on Schedule in Arizona; Dutch Government Announces Support for ASML appeared first on High-Performance Computing News Analysis | insideHPC.

A good March morning to you! Forthwith is a fast (5:51) run-though of recent HPC-AI news, including: The GPU shortage; HPE, Dell financial results, GPU allocations, new Intel fabs....

The post HPC News Bytes 20240304: GPU Scarcity, Global Fab Capacity Boost, AI Hurdles and Singapore’s AI Training Strategy (Including Mid-Careerists) appeared first on High-Performance Computing News Analysis | insideHPC.

KUMAMOTO, Japan, Feb. 24, 2024 – TSMC (TWSE: 2330, NYSE: TSM) held an opening ceremony for its majority-owned subsidiary Japan Advanced Semiconductor Manufacturing, Inc. (JASM) in Kumamoto Prefecture, Japan, bringing together suppliers, customers, business partners, academia and the Japanese government to show appreciation for their continued support and the joint effort that led to the […]

The post TSMC Opens JASM Chip Fab Subsidiary in Japan appeared first on High-Performance Computing News Analysis | insideHPC.

We’re seeing the chip industry’s version of the scientific aphorism: “nature hates a vacuum.” The vacuum is the short supply of – and vast demand for – AI chips, and it’s roiling the semiconductor industry. Chip foundry companies TSMC, Intel and Samsung are straining to expand GPU fab capacity....

The post Trillions for Chips: A Roiled Semiconductor Industry Strains to Meet AI Demand appeared first on High-Performance Computing News Analysis | insideHPC.

HSINCHU, Taiwan, R.O.C, Jun. 8, 2023—TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of its Advanced Backend Fab 6, the company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric integration of front-end to back-end process and testing services. The fab is prepared for mass production of TSMC-SoIC (System on Integrated Chips) […]

The post TSMC Opens Backend Fab 6 for Expansion of 3DFabric System Integration appeared first on High-Performance Computing News Analysis | insideHPC.