Interconnects & Networking Archives - High-Performance Computing News Analysis | insideHPC https://insidehpc.com/category/power-cooling/interconnects-networking/ At the Convergence of HPC, AI and Quantum Tue, 11 Feb 2025 19:14:59 +0000 en-US hourly 1 https://wordpress.org/?v=6.7.2 https://insidehpc.com/wp-content/uploads/2024/06/ihpc-favicon.png Interconnects & Networking Archives - High-Performance Computing News Analysis | insideHPC https://insidehpc.com/category/power-cooling/interconnects-networking/ 32 32 57143778 @HPCpodcast: Addison Snell on the Present and Future of HPC-AI, Quantum, DeepSeek, Interconnects, Leadership Supercomputing https://insidehpc.com/2025/02/hpcpodcast-addison-snell-on-the-present-and-future-of-hpc-ai-quantum-deepseek-interconnects-leadership-supercomputing-everything/ Fri, 07 Feb 2025 15:36:17 +0000 https://insidehpc.com/?p=95612

We delve into current market sizing for HPC-AI (the conjoining of the two being a relatively new focus), a look ahead at the rest of the year and the decade, the impact of hyperscalers on AI ....

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Emerald Invests in NLM Photonics Data Center Efficiency https://insidehpc.com/2025/01/emerald-invests-in-nlm-photonics-data-center-efficiency/ Wed, 29 Jan 2025 21:05:11 +0000 https://insidehpc.com/?p=95554

SEATTLE, January 29, 2025 – Emerald, a venture capital company, has invested in NLM Photonics to help bring energy-efficient, high performance electro-optic modulation technology to AI, data centers, quantum computing, and more. Other investors include Oregon Venture Fund, Tokyo Ohka Kogyo Co., Ltd., Pack Ventures, StoryHouse Ventures, and other existing NLM investors to support NLM’s […]

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HPC News Bytes: The Next New Big Thing in AI?, UALink and Optical I/O, Arm vs. Qualcomm https://insidehpc.com/2024/12/hpc-news-bytes-the-next-new-big-thing-in-ai-ualink-and-optical-i-o-arm-vs-qualcomm/ Mon, 23 Dec 2024 13:52:14 +0000 https://insidehpc.com/?p=95409

A happy holiday season to you! As we enter Christmas week, here’s a quick (6:14) run-through of  recent news from the world of HPC-AI, including: long thinking AI – the next new big thing?, UALink and optical I/O – a possible next new big thing in interconnects, Arm vs. Qualcomm ....

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Photonic Interconnect: Lightmatter Joins UALink Consortium https://insidehpc.com/2024/12/photonic-interconnect-lightmatter-joins-ualink-consortium/ Wed, 18 Dec 2024 21:52:19 +0000 https://insidehpc.com/?p=95395

Dec. 18, 2024, MOUNTAIN VIEW, Calif. –Photonic interconnect company Lightmatter has joined the Ultra Accelerator Link Consortium (UALink), an industry initiative focused on creating high-speed, low-latency open interconnect standards for scale-up AI systems. As a Contributor member, Lightmatter will apply its Passage technology—a 3D-stacked photonic engine—for accelerator-to-accelerator communication, enabling unprecedented performance in AI clusters. The UALink […]

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Optical Interconnect: Ayar Labs Secures Investments from AMD, Intel Capital, NVIDIA in $155M Round https://insidehpc.com/2024/12/optical-interconnect-ayar-labs-secures-155m-from-amd-intel-capital-and-nvidia/ Wed, 11 Dec 2024 16:14:34 +0000 https://insidehpc.com/?p=95339

SAN JOSE – Dec. 11, 2024 – Ayar Labs, an optical interconnect company for large-scale AI workloads, today announced it has secured $155 million in financing led by Advent Global Opportunities and Light Street Capital. This brings the company’s total funding to $370 million and raises the company’s valuation to above $1 billion. The strength of the […]

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Lenovo @ SC24: Smarter Creates Cooler HPC https://insidehpc.com/2024/10/lenovo-sc24-smarter-creates-cooler-hpc/ Wed, 23 Oct 2024 11:30:02 +0000 https://insidehpc.com/?p=94995

[SPONSORED GUEST ARTICLE]   SC24, the industry’s leading HPC technical conference, is taking place next month, and Lenovo will be there. HPC enthusiasts, influencers, and experts will gather in Atlanta, Georgia from November 17 – 22nd at the Georgia World Congress Center. This year, Lenovo’s theme is Smarter ....

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Intel’s 4 TB/s Integrated Optical I/O Chiplet Called ‘Important Milestone’ https://insidehpc.com/2024/06/intel-demonstrates-integrated-optical-i-o-chiplet/ Wed, 26 Jun 2024 14:40:12 +0000 https://insidehpc.com/?p=94301

Intel announced it has achieved an advance in integrated photonics technology for high-speed data transmission. The prototype OCI chiplet is designed to support 64 channels of 32 gigabits/second bidirectional data transmission on up to 100 meters of fiber optics ....

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‘Glow-in-the-Dark’ GPUs, Holes Burnt in Boards, Overprovisioning Systems ‘Until Funding Runs Out’ and Other Factors Calling for Optical I/O https://insidehpc.com/2023/12/glow-in-the-dark-gpus-holes-burnt-in-boards-overprovisioning-systems-until-funding-runs-out-and-other-factors-calling-for-optical-i-o/ Tue, 19 Dec 2023 19:41:53 +0000 https://insidehpc.com/?p=93117

[SPONSORED GUEST ARTICLE]  .... developments in photonics-based interconnects are so intriguing, offering the promise of increasing bandwidth by up to 1000x at 10%....

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Ayar Labs Names Mark Wade CEO https://insidehpc.com/2023/12/ayar-labs-names-mark-wade-ceo/ Mon, 11 Dec 2023 22:08:15 +0000 https://insidehpc.com/?p=93076

SANTA CLARA, Calif. – Dec. 11, 2023 – Silicon photonics company Ayar Labs today announced the appointment of co-founder and CTO Mark Wade (pictured here) to serve as its new CEO. Wade succeeds Charles Wuischpard, who will continue to serve in an advisory capacity over the coming weeks before he transitions out of the company […]

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@HPCpodcast: Silicon Photonics – Columbia Prof. Keren Bergman on the Why, How and When of a Technology that Could Transform HPC https://insidehpc.com/2023/04/silicon-photonics-columbia-prof-keren-bergman-on-the-why-how-and-when-of-a-technology-that-could-transform-hpc/ https://insidehpc.com/2023/04/silicon-photonics-columbia-prof-keren-bergman-on-the-why-how-and-when-of-a-technology-that-could-transform-hpc/#comments Mon, 10 Apr 2023 19:25:34 +0000 https://insidehpc.com/?p=91335

Silicon photonics has the potential to transform HPC: it’s a dual-threat interconnect technology that could – if and when it is wrestled into commercial, cost-effective form – move data within chips and systems much faster than conventional, copper-based interconnects while also delivering far greater energy efficiency. Venture-backed start-ups and established tech companies....

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